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Patent Searching and Data


Title:
PHOTORESIST COMPOSITION AND COATING MATERIAL
Document Type and Number:
Japanese Patent JP2001059005
Kind Code:
A
Abstract:

To obtain a photoresist composition excellent in smoothness, stain- proof, durability, etc., of a coating film and useful for a coating material by including a specific acrylic resin, a photoinitiator, etc.

This composition comprises (A) an acrylic resin having an unsaturated double bond capable of photocuring on its side chain, (B) a compound (e.g. a bifunctional silicone acrylate or the like) having an organic polysiloxane structure and at least one unsaturated double bond capable of photocuring in one molecule and (C) a photoinitiator such as 2-hydroxy-2- methyl-1-phenylpropan-1-one preferably in respective amounts of 80-95 wt.%, 5-20 wt.% and 3-7 pts.wt. based on the total of the ingredients A and B. The ingredient A is preferably a resin obtained by reacting (meth)acrylic acid with a prepolymer which is obtained by copolymerizing a glycidyl (meth)acrylate with an unsaturated compound (e.g. methyl methacrylate or the like) having one polymerizable unsaturated bond in one molecule.


Inventors:
HAMADA KEIJI
OYASU KENICHI
KONDO SHUICHI
Application Number:
JP23627399A
Publication Date:
March 06, 2001
Filing Date:
August 24, 1999
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08F290/12; C08F299/08; C09D4/06; (IPC1-7): C08F290/12; C08F299/08; C09D4/06
Attorney, Agent or Firm:
Kunihiko Wakabayashi