Title:
PHOTORESIST INK AND INK FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP3808999
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain the subject aqueous ink useful as e.g. an ink for producing printed wiring boards such as etching resist or solder resist, or as e.g. a resist for producing name plates, capable of development with water or alkaline solution, good in adhesiveness to substrate of the cured film formed by photopolymerization of this ink, and high in water resistance to e.g. etching liquid, soldering liquid.
SOLUTION: This ink comprises (A) a water-soluble photosensitive resin prepared by introducing styrylpyridinium or styrylquinolinium group into a polyvinyl alcohol-based polymer, (B) a compound having at least one photoreactive ethylenic unsaturated group in the molecule, (C) a photopolymerization initiator, and (D) water.
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Inventors:
Toshio Morigaki
Application Number:
JP33743497A
Publication Date:
August 16, 2006
Filing Date:
December 08, 1997
Export Citation:
Assignee:
Mutual Chemical Industry Co., Ltd.
International Classes:
C08F290/12; C09D11/02; C09D11/033; C09D11/10; C09D11/101; C09D11/102; C09D11/106; H05K3/00; (IPC1-7): C09D11/02; C09D11/10; H05K3/00; //C08F290/12
Domestic Patent References:
| JP8202030A | ||||
| JP4019543B2 | ||||
| JP60247637A | ||||
| JP62250440A | ||||
| JP60010244A | ||||
| JP60010243A | ||||
| JP11172177A |
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori
Atsuo Mori