To obtain a photosensitive additive adhesive resin compsn. which enables a highly accurate via hole to be formed by photoimaging through development with an aq. alkali soln. and has excellent resistance to a plating soln. in electroless plating, satisfactory strength of adhesion between the roughened surface of the adhesive and the plated copper, heat resistance good enough to withstand a temp. around 260°C at the time of soldering, and excellent insulating properties, and to provide a process for preparing a multilayer printed wiring board using the same.
This photosensitive additive adhesive compsn. comprises: a polyfunctional epoxy resin having an epoxy equivalent of 120 to 500; a modified phenol novolak prepd. by reacting 20 to 60% phenolic hydroxyl group with glycidyl acrylate or glycidyl methacrylate; an epoxy acrylate or epoxy methacrylate compd.; a diluent or a photopolymn. initiator of a photopolyfunctional monomer; and an acid-soluble filler. The process for preparing a multilayer printed wiring board uses the above adhesive compsn.
HAYAI CHIYUU
HOZUMI TAKESHI
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