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Title:
PHOTOSENSITIVE COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM AND PATTERNED CURED FILM
Document Type and Number:
Japanese Patent JP2021167906
Kind Code:
A
Abstract:
To provide: a photosensitive composition which gives a cured product having a low relative dielectric constant and can form a coating film having good conformability on a stepped substrate; a cured product of the photosensitive composition; and a method for producing a cured product using the photosensitive composition.SOLUTION: There is provided a photosensitive composition which comprises an alkali-soluble resin (A), a photopolymerizable compound (B) and a photopolymerization initiator (C), wherein an acrylic resin containing a structural unit (A-1) derived from a polycycloalkyl (meth)acrylate in a specific amount and having a weight average molecular weight of 90000 or more as the alkali-soluble resin (A).SELECTED DRAWING: None

Inventors:
KATO HIROKI
SOMEYA KAZUYA
HIKITA JIRO
Application Number:
JP2020071282A
Publication Date:
October 21, 2021
Filing Date:
April 10, 2020
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/004; G03F7/027; G03F7/031; G03F7/20
Domestic Patent References:
JP2018506532A2018-03-08
JP2016519675A2016-07-07
JP2018151489A2018-09-27
JP2012173678A2012-09-10
JP2018004841A2018-01-11
JP2011232659A2011-11-17
JP2011253110A2011-12-15
JP2012008537A2012-01-12
JP2013041153A2013-02-28
JP2018151490A2018-09-27
Foreign References:
KR20190129717A2019-11-20
WO2018021184A12018-02-01
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi