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Title:
PHOTOSENSITIVE MATERIAL FOR RELIEF FORMATION ON SURFACE BY LIGHT IRRADIATION, PHOTOSENSITIVE THIN FILM AND METHOD FOR RELIEF FORMATION USING THE PHOTOSENSITIVE MATERIAL
Document Type and Number:
Japanese Patent JP2003082033
Kind Code:
A
Abstract:

To obtain a photosensitive material for light surface relief formation which has high sensitivity for more improving relief formation efficiency, forms a relief having thermal stability and stability with time and has chemical stability to various organic solvents and a photosensitive thin film and to provide a method for pattern formation using the photosensitive material.

This azobenzene derivative is represented by general formula (1) (R1 is one kind selected from an alkyl group, an alkoxy group, a halogenated alkyl group and a halogenated alkoxy group; R2 and R3 are each H or an alkyl group; n is an integer of ≥1; x is a number satisfying 0<x<1). This method for relief formation comprises forming a photosensitive thin film by spin coating method or LB method, irradiating the thin film with light rays including light ray at 365 nm wavelength to form a chemical structure of cis form and irradiating the thin film with fixed light rays.


Inventors:
SEKI TAKAHIRO
ICHIMURA KUNIHIRO
ZETTSU NOBUYUKI
UBUKATA TAKASHI
Application Number:
JP2001282217A
Publication Date:
March 19, 2003
Filing Date:
September 17, 2001
Export Citation:
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Assignee:
RIKOGAKU SHINKOKAI
International Classes:
G03F7/004; C08F220/12; C08F220/28; C08F220/36; C08F290/06; G03H1/02; (IPC1-7): C08F220/36; C08F220/12; C08F220/28; C08F290/06; G03F7/004; G03H1/02
Attorney, Agent or Firm:
Dozo Isono