To obtain a photosensitive resin composition which has high sensitivity, gives a pattern having high residual film rate and high contrast and is excellent in the resolution of a fine pattern and in the shape of a pattern, and a new photosensitive polyamide used for the composition.

The photosensitive resin composition contains a photosensitive polyamide represented by formula (1) [wherein X1 is a group of formula (2) or formula (3) (wherein A1 is a single bond, O, C(CF3)2, CO or SO2); X2 is a group of formula (4) or formula (5) (wherein A2 is a single bond, O, C(CF3)2, CO or SO2); X3 is a divalent organic group; (a) and (b) are each a mol fraction, a+b=100 mol%, a=60.0 to 100 mol%, and b=0 to 40.0 mol%; D is a 1,2- naphthoquinonediazido-4-sulfonate residue, 1,2-naphthoquinonediazido-5-sulfonate residue, or H; and Z is an aliphatic, alicyclic or aromatic group having at least one alkenyl or alkynyl group].