Title:
PHOTOSENSITIVE POLYIMIDE COMPOSITION
Document Type and Number:
Japanese Patent JP3019601
Kind Code:
B2
Abstract:
PURPOSE: To obtain the title composition having high sensitivity and excellent heat resistance and dimensional stability by dissolving a polyimide compound having a specified molecular structure in a solvent.
CONSTITUTION: The title composition comprises a polyimide compound comprising repeating units of the formula (wherein R is alkyl) and a solvent. This compound is soluble in a highly polar solvent such as dimethylformamide or N-methylpyrrolidone or an organohalogen solvent such as dichloromethane, and a composition mainly consisting of this compound can be easily formed into a thin film by spin coating or casting.
Inventors:
Kazuyuki Horie
Shun Yamashita
Shun Yamashita
Application Number:
JP10791492A
Publication Date:
March 13, 2000
Filing Date:
April 27, 1992
Export Citation:
Assignee:
Mitsubishi Chemical Corporation
International Classes:
C08G73/10; C08L79/08; G03F7/027; G03F7/038; H01L21/027; H01L21/312; H05K3/28; (IPC1-7): C08L79/08; C08G73/10; G03F7/027; G03F7/038; H01L21/027; H01L21/312; H05K3/28
Domestic Patent References:
| JP418561A | ||||
| JP1263115A | ||||
| JP6347142A | ||||
| JP5829821A |
Attorney, Agent or Firm:
Koji Hasegawa
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