To easily obtain a polyimide film having good suitability to leveling of wiring steps and embedding of a fine groove pattern and capable of forming a pattern by the conventional known processing of a photosensitive polymer composition.

A photosensitive polymer composition is provided which comprises 100 pts.wt. polyimide resin precursor obtained by adding 2.0-4.0 mole ≤4C monohydric alcohol to 1 mole aromatic tetrabasic acid dianhydride in the presence of a solvent, heating these to convert part or all of the tetrabasic acid dianhydride to diester and reacting these with 0.1-1.0 mole amine compound of formula (I) (where R1 is an aromatic cyclic group; R2 is H or methyl and n is 1-3) in such an amount as to make the total amount of amine compounds 0.9-1.1 mole and 0.1-100 pts.wt. acrylic acid and/or methacrylic acid.