To obtain a photosensitive resin having a preferable balance in adhesivity to a substrate, improvement in a developed residue, pigment dispersibility and heat resistance.
The photosensitive resin is obtained by copolymerizing 5-30 mol% of a long-chain mono(meth)acrylate (a), 5-30 mol% of a rosin (meth)acrylate (b), 30-80 mol% of an epoxy group-containing radically polymerizable compound (c) and 10-60 mol% of another radically polymerizable compound (d) copolymerizable with the components (a), (b) and (c) in an amount to give the total amount of 100 mol%, adding an unsaturated monobasic acid (e) to 5-100% of the epoxy group contained in the obtained copolymer and adding a polybasic acid anhydride (f) to 5-100% of a hydroxy group formed in the addition of the component (e).
SATO HIKARI
YANAI TAKAYUKI
KINOSHITA TAKEHIRO
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Kazuhiro Oyaku