Title:
PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE FILM USING SAME
Document Type and Number:
Japanese Patent JP2001154353
Kind Code:
A
Abstract:
To provide a photosensitive resin composition excellent in pattern accuracy and adhesion, developable with a dilute alkali solution and suitable for a resistive element, a phosphor, a partition wall, a ceramic substrate, a conductor circuit or the like and a photosensitive film using the composition.
The photosensitive resin composition developable with an aqueous alkali solution contains a carboxyl-containing oligomer (A) having an ethylenically unsaturated double bond in a side chain obtained by a consecutive reaction and a functional inorganic powder (E).
Inventors:
MORI SATORU
MATSUO YUICHIRO
YOKOSHIMA MINORU
MATSUO YUICHIRO
YOKOSHIMA MINORU
Application Number:
JP33522699A
Publication Date:
June 08, 2001
Filing Date:
November 26, 1999
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
H01J9/02; G03F7/004; G03F7/027; H01J11/22; H01J11/34; H01J11/36; H01J11/42; (IPC1-7): G03F7/027; H01J9/02