Title:
PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND MULTILAYER MATERIAL
Document Type and Number:
Japanese Patent JP2022169681
Kind Code:
A
Abstract:
To provide a composition which has good developability and also high insulation reliability and flexibility and contains a maleimide compound comprising a diamine derived from a dimer acid and maleic anhydride, and to provide a cured product containing the composition.SOLUTION: A resin composition contains: a maleimide compound (I) which is a reaction product of a diamine (a-1) derived from a dimer acid and maleic anhydride; and a reactive polycarboxylic acid resin (II) which is a reaction product of a reactive epoxy carboxylate resin and a polybasic acid anhydride (b-3), the reactive epoxy carboxylate resin being a reaction product of an epoxy resin (b-1) and a compound (b-2) having both a polymerizable ethylenically unsaturated group and a carboxy group in one molecule.SELECTED DRAWING: None
Inventors:
Kengo Nishimura
Takafumi Minaguchi
Kazuyoshi Yamamoto
Mai Tsubamoto
Takafumi Minaguchi
Kazuyoshi Yamamoto
Mai Tsubamoto
Application Number:
JP2022132339A
Publication Date:
November 09, 2022
Filing Date:
August 23, 2022
Export Citation:
Assignee:
NIPPON KAYAKU KABUSHIKI KAISHA
International Classes:
C08F299/02