To provide a photosensitive resin composition superior in sensitivity and photocurability, capable of forming a pattern in high precision by photolithography and superior in folding resistance, solder resistance, flame retardancy, and coating operability on a film, and to provide a photosensitive laminate using this composition.
This photosensitive composition and the photosensitive laminate having a layer of this composition contain (A) an unsaturated isocyanate- modofield polyamide resin obtained by allowing an epoxy resin to react with the reaction product of a polycarboxic acid containing a polycarbonatediol- modified dicarboxylic acid and a diisocyanate and/or further allowing a moncarboxylic acid to react with this resin, and allowing the obtained epoxy- blocked type polyamide to react with an unsaturated isocyanate, (B) a photopolymerizable unsaturated compound having at least one ethylenically unsaturated group on the terminal, and (C) a photopolymerization initiator.
OTA FUMIHIKO
OBATA RITSUKO
AMANOKURA HITOSHI
NISHIZAWA HIROSHI
SUZUKI KENJI
