To provide a photosensitive resin composition which is excellent in basic properties such as developability and curability and is also excellent in both uncured film properties (tack-free properties, developability) and cured film physical properties (water resistance, flex resistance).

An epoxy resin, a phenol compound having an alcoholic hydroxy group, and an unsaturated monobasic acid are allowed to react with each other to obtain a curable resin, which is allowed to react with a polybasic acid anhydride to obtain a photosensitive resin. The photosensitive resin is obtained by using a difunctional epoxy resin as the epoxy resin and using a polybasic acid anhydride having a plurality of acid anhydride groups in a molecule as at least part of the polybasic acid anhydride. The photosensitive resin composition comprises the photosensitive resin and a photopolymerization initiator.