Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2022125717
Kind Code:
A
Abstract:
To provide a photosensitive resin composition which has low dielectric constant and dielectric loss and enables patterning by photolithography.SOLUTION: A photosensitive resin composition has: (A) a saturated hydrocarbon-based polymer structure having a molecular weight of 1000-100000; (B) at least one organic structure which has a molecular weight of 500 or less, and is selected from a group consisting of a trisubstituted isocyanurate structure, a trisubstituted triazine structure, a condensed ring structure having 7 to 16 carbon atoms, an alicyclic hydrocarbon structure having 6 to 12 carbon atoms, and a linear or branched alkyl ether structure having 6 to 24 carbon atoms; (C) at least one photo-cationic polymerizable functional group selected from a group consisting of an alicyclic epoxy group, a glycidyl group and an oxetanyl group; and (D) a siloxane bond, wherein the (A) is bonded to at least two Si atoms, and the (B) is bonded to at least one Si atom.SELECTED DRAWING: None
Inventors:
IDE MASAHITO
INENARI HIROSHI
MANABE TAKAO
INENARI HIROSHI
MANABE TAKAO
Application Number:
JP2021023460A
Publication Date:
August 29, 2022
Filing Date:
February 17, 2021
Export Citation:
Assignee:
KANEKA CORP
International Classes:
G03F7/075; C08F8/42; C08F10/10; C08F36/04; G03F7/004