Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2022125718
Kind Code:
A
Abstract:
To provide a thermosetting resin composition which has a low dielectric constant and a dielectric loss and is excellent in adhesion.SOLUTION: A thermosetting resin composition contains: (A) an organic compound having at least two alkenyl groups in one molecule; (B) a hydrosilylation catalyst; and (C) a compound having the following (α), (β) and (γ) structures and having a SiH group in one molecule. The (α) is a saturated hydrocarbon-based polymer structure which is bonded to at least two Si atoms, and has a molecular weight of 1000-100000. The (β) is an organic structure which is bonded to at least one Si atom, has a molecular weight of 500 or less, and contains at least one selected from a group consisting of a trisubstituted isocyanurate structure, a trisubstituted triazine structure, a condensed ring structure having 7 to 16 carbon atoms, an alicyclic hydrocarbon structure having 6 to 12 carbon atoms, and a linear or branched alkyl ether structure having 6 to 24 carbon atoms. The (γ) is a siloxane structure.SELECTED DRAWING: None
Inventors:
IDE MASAHITO
INENARI HIROSHI
MANABE TAKAO
INENARI HIROSHI
MANABE TAKAO
Application Number:
JP2021023461A
Publication Date:
August 29, 2022
Filing Date:
February 17, 2021
Export Citation:
Assignee:
KANEKA CORP
International Classes:
C08L23/26; C08F8/30; C08F8/42