Title:
感光性樹脂組成物、ドライフィルム、硬化物、および電子部品
Document Type and Number:
Japanese Patent JP7256057
Kind Code:
B2
Abstract:
To provide a photosensitive resin composition, which can be cured at a temperature of 240°C or lower while having a polyamic acid as a main component, has excellent mechanical characteristics such as breaking elongation, and is useful, for example, as an insulation layer for rewiring.SOLUTION: The photosensitive resin composition comprises (A) a polyamic acid, (B) a photosensitive agent, and (C) a heat radical generator, in which the (A) polyamic acid has a radically polymerizable functional group at a molecular chain terminal.SELECTED DRAWING: None
Inventors:
Hitomi Nakamura
Yuzuru Motomatsu
Yuzuru Motomatsu
Application Number:
JP2019069329A
Publication Date:
April 11, 2023
Filing Date:
March 29, 2019
Export Citation:
Assignee:
Taiyo Holdings Co., Ltd.
International Classes:
G03F7/004; C08F299/02; G03F7/023
Domestic Patent References:
| JP2018054937A | ||||
| JP9258441A | ||||
| JP6089028A |
Foreign References:
| WO2016140024A1 | ||||
| KR100463035B1 |
Attorney, Agent or Firm:
Honda Ichiro
Yumiko Sugimoto
Takumi Watanabe
Takashi Daejeon
Takashi Fujimura
Yumiko Sugimoto
Takumi Watanabe
Takashi Daejeon
Takashi Fujimura
Previous Patent: air bag device
Next Patent: TREATMENT OF OLEFINIC MALODOROUS GAS BY SULFURIC ACID TREATED TRANSITION METAL OXIDE CATALYST
Next Patent: TREATMENT OF OLEFINIC MALODOROUS GAS BY SULFURIC ACID TREATED TRANSITION METAL OXIDE CATALYST