Title:
PHOTOSETTING AND THERMOSETTING COMPOSITION
Document Type and Number:
Japanese Patent JPH01136144
Kind Code:
A
Abstract:
PURPOSE:To obtain a photosetting and thermosetting compsn. having high heat resistance to soldering, adhesive property, resolution, acid resistance, alkali resistance, solvent resistance, film strength, and surface hardness by incorporating a specified linear polymer, photopolymerizable monomer, epoxy resin, photosensitizer, and thermosetting agent into a compsn. CONSTITUTION:The title compsn. contains 10-90wt.% linear polymer having an ethylenic unsatd. group and a COOH group in the side chain and 5-90wt.% photopolymerizable monomer having at least two ethylenic unsatd. groups in the terminal. Moreover, the composition contains 1-90wt.% epoxy resin having at least two epoxy groups in a molecule, 0.01-15wt.% photosensitizer, and 0.01-15wt.% thermosetting agent. By using the compsn. for a solder resist for forming a solder mask in the prepn. of a print circuit board, a permanent protective film having high heat resistance to soldering, high adhesive property, high resolution, high acid resistance and high alkali resistance, high solvent resistance, high film strength, and high surface hardness is obtd.
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Inventors:
TAKADA HISAMI
SHIRATO HITOSHI
SHIRATO HITOSHI
Application Number:
JP29438787A
Publication Date:
May 29, 1989
Filing Date:
November 21, 1987
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08F283/10; C08F2/48; C08F283/00; C08G59/00; C08L33/04; C08L63/00; G03F7/032; G03F7/033; (IPC1-7): C08F2/48; C08F283/10; C08L33/04; C08L63/00; G03C1/68