物理気相堆積システム及びプロセス - APPLIED MATERIALS,INCORPORATED

Title:

物理気相堆積システム及びプロセス

Document Type and Number:

Japanese Patent JP7274594

Kind Code:

B2

Abstract:

A physical vapor deposition (PVD) chamber and a method of operation thereof are disclosed. Chambers and methods are described that provide a chamber comprising an upper shield with two holes that are positioned to permit alternate sputtering from two targets.

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Inventors:

Xiao, Wen
Jindal, Biboo
Bert, Sanjay

Application Number:

JP2021549623A

Publication Date:

May 16, 2023

Filing Date:

February 27, 2020

Export Citation:

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Assignee:

APPLIED MATERIALS,INCORPORATED

International Classes:

C23C14/34; C23C14/56

Domestic Patent References:

JP2005139549A
JP2007107888A
JP2019502030A
JP11302841A
JP5126999A
JP2011097041A
JP2243762A
JP2005281832A
JP60029956A

Foreign References:

US20180291500
US20030132107

Attorney, Agent or Firm:

Sonoda & Kobayashi Patent Attorneys Corporation

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