To provide a piping member overcoming defects of polyphenylene ether-based resin compositions, excellent in high temperature creep property, having rigidity even at a high temperature (60-95C), capable of being produced by using the same production system as that for vinyl chloride resins and having good moldability and good appearance.
The piping member comprises a resin composition comprising 100 pts.mass polyphenylene ether-based resin and 50-12 pts.mass polystyrene-based resin as essential components and having 1.0-5.0 g/10 min melt flow rate after kneading. The elements are further characterized in each of a mold shrinkage of 0.5-0.8%, a high temperature creep property of 1,000 h till breakdown under conditions of 95C atmosphere and 5.0 MPa tension load, and a moisture content in the resin composition, of 250 ppm after kneading and before molding.
INOUE TAKANORI
| JPH08238717A | 1996-09-17 | |||
| JP2005239784A | 2005-09-08 | |||
| JP2003185064A | 2003-07-03 | |||
| JP2003014190A | 2003-01-15 | |||
| JP2003049065A | 2003-02-21 |
| WO2005108051A1 | 2005-11-17 |
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Next Patent: PROTON-CONDUCTIVE ORGANIC-INORGANIC HYBRID FILM AND PRODUCTION METHOD THEREOF