Title:
平面加工装置
Document Type and Number:
Japanese Patent JP7258566
Kind Code:
B2
Abstract:
To provide a flat surface processing device which enables a grind stone to be attached to a spindle safely and easily.SOLUTION: A flat surface processing device 1 includes: a suction holding mechanism which is provided at a spindle flange 26 connected to a spindle 23 and generates a negative pressure between itself and an annular grind stone wheel 21a holding a grind stone 21 to suction and hold the grind stone wheel 21a on the spindle flange 26; and a friction holding mechanism which moves a pressing wheel 61 provided at a lower end of the spindle 23 in a vertical direction V to cause a collet 62 inserted on the pressing wheel 61 to expand its diameter in a radial direction R of the spindle 23 and hold and retain the grind stone wheel 21a with the collet 62.SELECTED DRAWING: Figure 10
Inventors:
Yuki Maeda
Adachi Adachi
Adachi Adachi
Application Number:
JP2019005595A
Publication Date:
April 17, 2023
Filing Date:
January 16, 2019
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B24B45/00; B24B7/04; B24B41/047; B24D7/06; H01L21/304
Domestic Patent References:
| JP2014100772A | ||||
| JP2016144842A | ||||
| JP51145073A | ||||
| JP2010030011A | ||||
| JP2016144839A |
Foreign References:
| US20060121840 |
Attorney, Agent or Firm:
Takamitsu Shimizu