Title:
POLISHING AGENT, POLISHING AGENT SET AND METHOD FOR POLISHING SUBSTRATE
Document Type and Number:
Japanese Patent JP2015129217
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing agent, a polishing agent set and a polishing method capable of obtaining a polishing speed for a useful insulating material and improving smoothness of a substrate surface.SOLUTION: There is provided a polishing agent which comprises water, cerium oxide particles, saccharides having 140 or less carbon atoms, a nonionic surfactant and an organic acid, where the cerium oxide particles are single-crystal particles, the surface potential in the polishing agent is negative. The primary particle diameter (crystallite diameter) of abrasive grains is 1 nm or more and 300 nm or less.
Inventors:
AKUTSU TOSHIAKI
Application Number:
JP2014000904A
Publication Date:
July 16, 2015
Filing Date:
January 07, 2014
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| JP2013540851A | 2013-11-07 | |||
| JP2012079879A | 2012-04-19 |
Foreign References:
| WO2006001558A1 | 2006-01-05 | |||
| WO2013035034A1 | 2013-03-14 |