To provide a polishing compound which enables embedded wiring with low dishing, low erosion and few scratches to be formed at high polishing speed through the use of the polishing compound in polishing a substrate, having an insulative film on which a wiring metal film and a barrier film are formed.
The polishing compound includes steps of dissolving a heterocyclic benzene compound, such as benzotriazole, in one or more organic solvents selected from among a group consisting of a primary alcohol having 1 to 4 carbon atoms, a glycol having 2 to 4 carbon atoms, an ether represented by CH3CH(OH)CH2OCmH2m+1, wherein m is an integer of 1 to 4, N-methyl-2-pyrrolidone, N,N-dimethylformamide, dimethyl sulfoxide, γ-butyloractone and propylene carbonate; and then mixing the resulting solution with an aqueous dispersion of fine oxide particles as abrasive grains.
NAKAZAWA NORIHITO
KIN YOSHINORI
ASAHI GLASS CO LTD
JPH1140526A | 1999-02-12 | |||
JP2001185515A | 2001-07-06 |
WO2000039844A1 | 2000-07-06 |
Takamasa Asano
Kenji Doi