POLISHING DEVICE AND METHOD

Title:

POLISHING DEVICE AND METHOD

Document Type and Number:

Japanese Patent JPH11179652

Kind Code:

A

Abstract:

To provide a polishing device and method whereby nonuniformity of polishing can be easily corrected, and to polish so as to adjust a stock removable in aimed partial region of a polishing surface.

This device has a turntable 5 sticking a polishing cloth 6 in an upper surface and a top ring 1, a polishing object 4 is interposed between the turntable 5 and the top ring 1, and by pressing with prescribed force, the polishing object 4 is polished into flatness and mirror finished. Here, in a hold surface with the top ring 1 holding the polishing object, a plurality of vacuum suction possible openings 10, 20 are provided, a plurality of the openings 10, 20 are divided into a plurality of regions C1, C2, C3, and vacuum suction is made possible in each region.

Inventors:

WADA TAKETAKA
HIYAMA HIROKUNI
HIROKAWA KAZUTO
MATSUO NAONORI

Application Number:

JP36395297A

Publication Date:

July 06, 1999

Filing Date:

December 17, 1997

Export Citation:

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Assignee:

EBARA CORP

International Classes:

B24B37/30; H01L21/304; (IPC1-7): B24B37/04; H01L21/304

Attorney, Agent or Firm:

Isamu Watanabe (2 outside)

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