Title:
研磨装置
Document Type and Number:
Japanese Patent JP7075650
Kind Code:
B2
Abstract:
To provide an extremely practical polishing device.SOLUTION: In this polishing device, a polishing body part 1 for polishing a work-piece W is provided on a work-piece anchor block part 50 for fixation of the work-piece W, the polishing body part 1 is provided with a rotary polishing part 2 which contacts the work-piece W while rotating thereby polishing the work-piece W, the rotary polishing part 2 is provided with a cover part 3 which prevents dispersion of polished powder dusts P which are generated during polishing of the work-piece, the cover part 3 is provided with a lead-out opening 3a for lead-out of the polished powder dusts, and a suction tip opening part 4a of a suction part 4 is provided continuously with the lead-out opening 3a, and thus, the polished powder dusts P in the cover part 3 can be recovered.SELECTED DRAWING: Figure 1
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Inventors:
Fumiaki Saito
Fumihiro Ichikawa
Fumihiro Ichikawa
Application Number:
JP2017192841A
Publication Date:
May 26, 2022
Filing Date:
October 02, 2017
Export Citation:
Assignee:
ST LINK Co., Ltd.
International Classes:
B24B55/06; B24B45/00
Domestic Patent References:
| JP2063949U | ||||
| JP2007301638A | ||||
| JP2010221383A | ||||
| JP2006130575A | ||||
| JP8071884A |
Foreign References:
| US20090298402 | ||||
| US5100270 |
Attorney, Agent or Firm:
Tsuyoshi Yoshii
Masae Yoshii
Masae Yoshii