To provide a polishing method to be executed in such an arrangement that a correcting tray, a workpiece, and a dummy for measurement are placed on a lapping machine rotating, wherein the positional adjustment of the correcting tray is conducted quickly and certainly.

A polishing method is executed in such an arrangement that a correcting tray, a workpiece, and a dummy 23 for measurement are placed on a lapping machine rotating, wherein the workpiece is polished while the workpiece and dummy 23 are swung together. A runoff part 23a is formed approx. uniformly over the whole polishing surface of the dummy 23, and the position of the tray on the lapping machine is adjusted on the basis of the shape of the polishing surface of the dummy 23.