POLISHING PAD FOR CMP CONTAINING BUBBLES

Title:

POLISHING PAD FOR CMP CONTAINING BUBBLES

Document Type and Number:

Japanese Patent JP2003249470

Kind Code:

A

Abstract:

To provide a polishing pad for CMP whose water absorption rate is low, hardness is proper and durability is good by removing existing defects, and its manufacturing method.

The polishing pad for CMP is formed of resin which comprises a metathesis polymerizable cyclic olefin and has heat distortion temperature of 90 to 130°C. The polishing pad contains practically independent bubbles having an average diameter of 50 μm of less measured from its cross section, and the surface density of bubbles is not less than 1E+4 bubbles/cm2.

More Like This:

WO/2017/079196	POLISHING PAD WITH FOUNDATION LAYER AND WINDOW ATTACHED THERETO
JP6856340	Polishing pad manufacturing method and polishing pad manufacturing equipment
JP2003053658	POLISHING PAD WITH ITS USE STATE MONITORED AND REPLACING METHOD USING THE SAME

Inventors:

NAKATANI KENJI
ABE MASANORI
YOSHIDA EIJI

Application Number:

JP2002047643A

Publication Date:

September 05, 2003

Filing Date:

February 25, 2002

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TEIJIN METON KK

International Classes:

B24B37/20; B24B37/24; B29C45/00; C08G61/06; C08J5/14; H01L21/304; B29K45/00; B29K105/04; B29L31/00; C08L65/00; (IPC1-7): H01L21/304; B24B37/00; B29C45/00; C08G61/06; C08J5/14

Attorney, Agent or Firm:

Hideko Mihara

Previous Patent: SUBSTRATE POLISHING METHOD

Next Patent: METHOD AND DEVICE FOR FILM THICKNESS MEASUREMENT AND MANUFACTURING METHOD OF THIN FILM DEVICE