To provide a polishing pad capable of high speed polishing while suppressing occurrence of micro polishing scratches when the surface of an interlayer insulating film, a BPSG film, a shallow trench isolating insulation film, a capacitor ferroelectric film, an interconnection metal film, or an article being polished is polished and planarized, or when a buried layer is formed.
The polishing pad having a function for holding particles in polishing agent is produced by fixing organic fibers through substantially non-foaming resin to have an organic fiber content of 50 mass% or above. The polishing pad has Shore D surface hardness of 60 or above and the organic fibers are exposed to the pad surface during polishing work. In the polishing method, surface of an article being polished is applied to the surface of the polishing pad where the organic fibers are exposed and then the article being polished and the polishing pad are slid relatively while supplying slurry polishing agent.
SHIMAMURA YASUO
IWATSUKI YASUHITO
TAKAHASHI KATSUHARU
SHIN KOBE ELECTRIC MACHINERY
Next Patent: POLISHING PAD AND METHOD FOR MANUFACTURING POLISHED ARTICLE