Title:
POLYACETAL RESIN COMPOSITION AND MOLDING
Document Type and Number:
Japanese Patent JP2007145979
Kind Code:
A
Abstract:
To obtain a polyacetal resin composition that controls an amount of formaldehyde generated to an extremely low level and controls a mold deposit derived from an additive.
The polyacetal resin composition comprises (A) 100 parts wt. of a polyacetal resin, (B) 0.01-5.0 parts wt. of a specific triazole compound and (C) 0.01-5.0 parts wt. of a hindered phenol-based antioxidant.
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Inventors:
KAWAGUCHI KUNIAKI
KURITA HAYATO
KURITA HAYATO
Application Number:
JP2005341917A
Publication Date:
June 14, 2007
Filing Date:
November 28, 2005
Export Citation:
Assignee:
POLYPLASTICS CO
International Classes:
C08L59/00; C08K3/00; C08K5/00; C08K5/13; C08K5/3472
Attorney, Agent or Firm:
Satoshi Furuya
Takahiko Mizobe
Shinji Mochida
Yoshitsune Kazumasa
Takahiko Mizobe
Shinji Mochida
Yoshitsune Kazumasa
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