Title:
ポリアセタール樹脂組成物
Document Type and Number:
Japanese Patent JP5354050
Kind Code:
B2
Abstract:
A polyacetal resin composition comprising 100 parts by weight of a polyacetal polymer, 0.01 to 0.5 part by weight of a hydrazide compound, 0.01 to 0.1 part by weight of an amino-substituted triazine compound and 0.01 to 5 parts by weight of a hindered phenolic compound, wherein the resin composition has a total content of hydroxides, organic acid salts and inorganic acid salts of an alkali metal and an alkali earth metal of 50 ppm or less by weight in terms of the total of the alkali metal and the alkali earth metal; and a molded article thereof. The polyacetal resin composition greatly suppresses the emission of formaldehyde from a pellet or molded article thereof and rarely produces a mold deposit.
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Inventors:
Daisuke Sucho
Yuji Takeda
Akira Ito
Satoshi Nagai
Yuji Takeda
Akira Ito
Satoshi Nagai
Application Number:
JP2012087104A
Publication Date:
November 27, 2013
Filing Date:
April 06, 2012
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
C08L59/00; C08K5/13; C08K5/25; C08K5/3492
Domestic Patent References:
| JP2006111874A | ||||
| JP2005263921A | ||||
| JP2005162909A | ||||
| JP2005325225A |
Foreign References:
| WO2004058884A1 | ||||
| WO2004058875A1 |