Title:
ポリアミック酸およびポリイミド
Document Type and Number:
Japanese Patent JP5315994
Kind Code:
B2
Abstract:
A polyamic acid comprising at least 10 mol % repeating units represented by the formula [1] or [2]; and a polyimide represented by the formula [3] or [4] which is obtained from the polyamic acid. A polyimide film having high heat resistance and satisfactory in light-transmitting properties and tensile strength is obtained from the polyamic acid. (In the formulae, R1 and R2 each independently represents hydrogen or C1-10 alkyl; R3 and R4 each independently represents hydrogen, halogeno, C1-10alkyl, or phenyl or the R3 and R4 on adjoining carbon atoms are bonded to each other to form C3-8 cycloalkyl or phenyl; R5 represents a divalent organic group; and n is an integer of 2 or larger.)
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Inventors:
Hideo Suzuki
Takayuki Tamura
Yoshikazu Otsuka
Takayuki Tamura
Yoshikazu Otsuka
Application Number:
JP2008524779A
Publication Date:
October 16, 2013
Filing Date:
July 09, 2007
Export Citation:
Assignee:
Nissan Chemical Industry Co., Ltd.
International Classes:
C08G73/10
Domestic Patent References:
| JP2004149609A | 2004-05-27 | |||
| JPH05341291A | 1993-12-24 | |||
| JP2004149609A | 2004-05-27 | |||
| JPH05341291A | 1993-12-24 |
Foreign References:
| US3522160A | 1970-07-28 |
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa