Title:
ポリアミド樹脂の接合助剤、並びにこれを用いた射出成形接合方法、及び超音波溶着接合方法
Document Type and Number:
Japanese Patent JP4246619
Kind Code:
B2
Abstract:
To join polyamide resins with each other with a sufficient joining strength.
A joining auxiliary for the polyamide resin with which a predetermined joining face is coated to ensure a joining strength between the predetermined joining face of a molded article of the polyamide resin and another polyamide resin when they are joined together, has a composition comprising a compound (1) for cutting hydrogen bondings of the molded article of a polyamide resin while dissolution of the polyamide resin is assisted with it, in an organic solvent capable of dissolving the polyamide resin.
COPYRIGHT: (C)2004,JPO&NCIPI
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Inventors:
Akihiro Yoshino
Kondo Yoneo
Koji Tomoda
Kondo Yoneo
Koji Tomoda
Application Number:
JP2003426100A
Publication Date:
April 02, 2009
Filing Date:
December 24, 2003
Export Citation:
Assignee:
Katazen Co., Ltd.
International Classes:
C08J5/12; C09J201/00; C09D5/00; C09D7/12; C09D177/00; C09D177/02; C09D177/06; C09J5/00; C09J11/06; C09J177/00; C08L77/00
Domestic Patent References:
| JP2003089131A | ||||
| JP51130437A | ||||
| JP59157125A |
Other References:
接着ハンドブック,日本,日刊工業新聞社,1996年 6月28日,第3版,p.343-346,p.831-852
接着百科(下),日本,株式会社高分子刊行会,1976年 8月25日,初版,p.146-154,p.165-173
接着百科(下),日本,株式会社高分子刊行会,1976年 8月25日,初版,p.146-154,p.165-173
Attorney, Agent or Firm:
Tetsuhiro Naito
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