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Title:
多結晶シリコン製造装置
Document Type and Number:
Japanese Patent JP7106469
Kind Code:
B2
Abstract:
An integrated sleeve structure is provided between an electrode configured to feed power to a silicon core wire and a bottom plate part. Sealing members are arranged on at least part of a flange part of an insulating member and on at least part of a straight part of the insulating member.

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Inventors:
National Cheng Kung University
Tetsuro Okada
Masahiko Ishida
Application Number:
JP2019027952A
Publication Date:
July 26, 2022
Filing Date:
February 20, 2019
Export Citation:
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Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C01B33/035; F27D7/06; F27D9/00; F27D11/10
Domestic Patent References:
JP2010030878A
JP2018502031A
JP2013018675A
Foreign References:
CN201424378Y
CN101565184B
Attorney, Agent or Firm:
Seiji Ohno
Morita Koji
Kenichi Katayama



 
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