To provide a method of manufacturing a polyimide-copper foil laminated plate, the method for manufacturing an extremely thin flexible printed circuit board for a high density circuit pattern highly efficiently in a high yield while reducing production steps.
The polyimide-copper foil laminated plate is composed of the first copper foil 100, the first thermosetting polyimide film 110, a thermoplastic polyimide film 120, the second thermosetting polyimide film 130, and the second copper foil 140, these being bonded in this order. The manufacturing method of the polyimide-copper foil laminated plate comprises forming the thermosetting resin polyimide layer on the copper foil, bonding two structures using the thermoplastic polyimide layer, each structure being made by forming the thermosetting polyimide layer on the copper foil, finally heating and pressing them.
LI KUO-WEI
Mizuno Katsufumi
Hiroshin Takano
Ogawa Hidenori
Kawakami adult