To provide a polymer composition which can give a crosslinked polymer exhibiting excellent heat resistance even at a temperature of 350°C or higher without any adverse affect on mechanical strengths, moisture resistance, electrical properties, and many other properties, to provide a coating varnish obtained from the polymer composition, a resin film obtained from the polymer composition or the coating varnish, and to provide a semiconductor device using the same.
The polymer composition is one comprising an amino-containing compound and a carboxy-containing compound, wherein at least either of the amino-containing compound and the carboxy-containing compound is a polymer. The coating varnish comprises the polymer composition and an organic solvent which can dissolve or disperse the polymer composition. The resin film is obtained by heat-treating the polymer composition or the coating varnish. The semiconductor device has the resin film.
ONO KOJI
ENOKI HISAFUMI
