Title:
POLYOXYMETHYLENE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3706252
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polyoxymethylene resin composition that has improved thermal stability, particularly in terms of mold deposit and discoloration during molding and is improved in the formation of blackish foreign spots in the molded products.
SOLUTION: This resin material is prepared by formulating (a) 0.01-3 pts.wt. of a sterically hindered phenolic antioxidant, (b) 0.0001-0.1 pt.wt. of an ionic salt of an α-olefin and α,β-ethylenically unsaturated carboxylic acid copolymer (c) 0.001-0.5 pt.wt. of at least one of metal-containing compounds selected from the group consisting of oxides and carbonates of magnesium and calcium to 100 pts.wt. of polyoxymethylene.
Inventors:
Ninokura Hideki
Noriyuki Sugiyama
Noriyuki Sugiyama
Application Number:
JP18413098A
Publication Date:
October 12, 2005
Filing Date:
June 30, 1998
Export Citation:
Assignee:
Polyplastics Co., Ltd.
International Classes:
C08K3/22; C08K3/26; C08K5/13; C08L59/00; (IPC1-7): C08L59/00; C08K3/22; C08K3/26; C08K5/13
Domestic Patent References:
| JP62212452A | ||||
| JP9235448A |
Attorney, Agent or Firm:
Satoshi Furuya
Kaoru Furuya
Takahiko Mizobe
Shinji Mochida
Kaoru Furuya
Takahiko Mizobe
Shinji Mochida
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