Title:
ポリオキシメチレン樹脂組成物
Document Type and Number:
Japanese Patent JP6865817
Kind Code:
B2
Abstract:
The present invention relates to a polyoxymethylene resin composition, which has excellent thermal stability and a low weight-reduction rate and thus can be favorably used in various industrial fields and used as an engineering plastic in fields of machine parts and the like.
Inventors:
Byung, Kyung Sob
Ju, Sun Fan
Lee, Chang Ho
Choi, Kwang Young
Ju, Sun Fan
Lee, Chang Ho
Choi, Kwang Young
Application Number:
JP2019518277A
Publication Date:
April 28, 2021
Filing Date:
October 13, 2017
Export Citation:
Assignee:
KOREA ENGINEERING PLASTICS CO., LTD.
International Classes:
C08L59/02; C08G2/08; C08G2/10; C08K3/32; C08K5/053; C08K5/3445
Domestic Patent References:
| JP6345938A | ||||
| JP6345937A | ||||
| JP10251481A | ||||
| JP2004026857A | ||||
| JP2005171157A | ||||
| JP2006045331A | ||||
| JP2005263921A |
Attorney, Agent or Firm:
Patent Corporation Nagato & Partners