POLYPROPYLENE MOLDING AND PREPARATION OF ITS BASE RESIN

Title:

POLYPROPYLENE MOLDING AND PREPARATION OF ITS BASE RESIN

Document Type and Number:

Japanese Patent JPH09151214

Kind Code:

A

Abstract:

To prepare a crystalline polypropylene molding having higher heat resistance (HDT; °C) than expected from its m.p. (Tm; °C), and its base crystalline polypropylene.

Polypropylene molded item satisfying the following relationship between heat deflection temp (HDT; °C) and m.p. (Tm; °C), 5.7≤1.18×(Tm)-(HDT)≤6.9 is obtd. by molding the following crystalline polypropylene. The crystalline polypropylene is obtd. by polymerizing propylene itself or by copolymerizing propylene and a 2-12C α-olefin except propylene with a metallocene, selected from hafnocene, zirconocene or titanocene and aluminoxanes as catalysts.

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Inventors:

SAITO JUN
KAWAMOTO HISAFUMI
KAGEYAMA AKIKO
HATADA KOICHI
OKI YOSHIYUKI

Application Number:

JP33390795A

Publication Date:

June 10, 1997

Filing Date:

November 29, 1995

Export Citation:

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Assignee:

CHISSO CORP

International Classes:

C08F4/642; C08F4/60; C08F4/6592; C08F10/00; C08F210/06; (IPC1-7): C08F210/06; C08F4/642

Attorney, Agent or Firm:

Haruo Deda

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