To provide an epoxy resin which obtains a cured material excellent in flame retardancy, moisture resistance, low elasticity, or the like, is used for sealing an electronic components and is suitable for a circuit board material or the like, and to provide a polyvalent hydroxy resin and an epoxy resin composition.
The styrene-modified polyvalent hydroxy resin is obtained by reacting 1 mole polyvalent hydroxy compound such as a phenol novolac resin with 0.1-4.0 moles styrenes in the presence of an acid catalyst and has 250-400 g/eq. hydroxyl equivalent. The epoxy resin is obtained by reacting the polyvalent hydroxy compound with epichlorohydrin and has 310-500 g/eq. epoxy equivalent. The epoxy resin composition contains the polyvalent hydroxy resin or the epoxy resin as an essential component.
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NAKAHARA KAZUHIKO
KAJI MASASHI
| JP2006117762A | 2006-05-11 | |||
| JPH08120039A | 1996-05-14 | |||
| JP2009242658A | 2009-10-22 | |||
| JP2005187607A | 2005-07-14 | |||
| JPH0656964A | 1994-03-01 | |||
| JPH08301980A | 1996-11-19 | |||
| JP2001302763A | 2001-10-31 |
Katsuo Naruse
Tomohiro Nakamura
Eiichi Sano