Title:
APPARATUS AND METHOD OF POLISHING AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3187162
Kind Code:
B2
Abstract:
PURPOSE: To provide an apparatus for uniformly polishing the wafer surface on which interconnections covered with insulation are formed, without observing the polished surface of a wafer during a polishing.
CONSTITUTION: A rotatable table 21, a first conductor film 22 formed on the table 21, a polishing cloth 23 formed on the first conductor film 22 in which openings 24 are formed so as to expose the first conductor film 22, and a second conductor film 26 formed on a holding surface of a wafer 30 are provided. Further, a rotatable wafer holding member 25 in which the holding surface is arranged opposite to the polishing cloth 23 and the wafer 30 on the holding surface is brought into contact with the polishing cloth 23 by a movement of the table 21 or itself and the wafer 30 is polished, a nozzle 27 for discharging a polishing agent containing ions, and a power source 28 to which the first and second conductor films 22 and 26 are connected through current detecting means 29 are included.
Inventors:
Sadahiro Kishii
Yoshihiro Arimoto
Hiroshi Horie
Fumitoshi Sugimoto
Yoshihiro Arimoto
Hiroshi Horie
Fumitoshi Sugimoto
Application Number:
JP27044092A
Publication Date:
July 11, 2001
Filing Date:
October 08, 1992
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L21/304; B24B37/013; H01L21/3205; H01L21/321; H01L21/768; (IPC1-7): H01L21/304; B24B37/04; H01L21/3205
Domestic Patent References:
| JP618943A | ||||
| JP1207929A | ||||
| JP397226A | ||||
| JP5554174A | ||||
| JP3174740A | ||||
| JP4261773A |
Attorney, Agent or Firm:
Keizo Okamoto