Title:
POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING PATTERN BY USING SAME
Document Type and Number:
Japanese Patent JP2005062722
Kind Code:
A
Abstract:
To provide a positive resist composition which shows sufficient transmitting property when an exposure light source at ≤160 nm, specifically, F2 excimer laser light (at 157 nm) is used and which is improved in surface roughness, development defect, scum and resolving power, and to provide a method for forming a pattern by using the composition.
The positive resist composition contains: (A) a compound which generates an acid by irradiation of active rays or radiation; (B) a resin which has a specified repeating unit expressed by general formula (I) and a specified repeating unit and the solubility of which with an alkaline developing solution is increased by the effect of an acid; and (C) a solvent.
Inventors:
MIZUTANI KAZUYOSHI
Application Number:
JP2003296000A
Publication Date:
March 10, 2005
Filing Date:
August 20, 2003
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F212/14; C08F220/18; C08F220/22; C08F232/00; H01L21/027; (IPC1-7): G03F7/039; C08F212/14; C08F220/18; C08F220/22; C08F232/00; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada
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