Title:
POSITIVE RESIST COMPOSITION
Document Type and Number:
Japanese Patent JP2005010392
Kind Code:
A
Abstract:
To provide a positive resist composition suitable for use under an exposure light source of ≤250 nm, particularly F2 excimer laser light (157 nm), and specifically to provide a positive resist composition exhibiting satisfactory transmittance when a light source of 157 nm is used and excellent in such various properties as affinity for a developer and image forming properties.
This positive resist composition contains (A) a resin having at least a repeating unit represented by formula (A1) and having solubility in an alkali developer increased by the action of an acid and (B) a compound which generates an acid upon irradiation with an actinic ray or radiation.
Inventors:
KANDA HIROMI
MIZUTANI KAZUYOSHI
MIZUTANI KAZUYOSHI
Application Number:
JP2003173560A
Publication Date:
January 13, 2005
Filing Date:
June 18, 2003
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03F7/039; C08F210/02; C08F212/08; C08F216/00; C08F220/10; C08F232/04; H01L21/027; (IPC1-7): G03F7/039; C08F210/02; C08F212/08; C08F216/00; C08F220/10; C08F232/04; H01L21/027
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada
Hironori Honda
Toshimitsu Ichikawa
Takeshi Takamatsu
Yuriko Hamada