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Title:
POSITIVE TYPE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP3948646
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a positive type resist composition having excellent resolution and etching resistance, capable of giving a resist pattern that undergoes a small dimensional change per unit temperature by a thermal flow process and having good aging stability.
SOLUTION: The positive type resist composition contains (A) a base resin component comprising at least one hydroxystyrene copolymer having an acid dissociable group substituted for the hydrogen atom of at least part of phenolic hydroxyl groups or carboxyl groups present in the copolymer, (B) a compound which generates an acid when irradiated with radiation, (C) a crosslinkable polyvinyl ether compound, (D) a carboxylic acid consisting only of carbon, oxygen and hydrogen atoms and (E) an organic amine.


Inventors:
Kazuyuki Nitta
Kazuhito Sato
Daisuke Kawana
Satoshi Shimatani
Application Number:
JP2000264529A
Publication Date:
July 25, 2007
Filing Date:
August 31, 2000
Export Citation:
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Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
G03F7/039; C08F2/44; C08F257/00; C08K5/00; C08K5/09; C08K5/17; C08L25/18; G03F7/004; G03F7/40; H01L21/027; (IPC1-7): G03F7/039; C08F2/44; C08F257/00; C08K5/00; C08K5/09; C08K5/17; C08L25/18; G03F7/004; G03F7/40; H01L21/027
Domestic Patent References:
JP10293404A
JP10153854A
JP10097074A
JP10020501A
JP9274320A
JP1307228A
JP2001142199A
JP2000356850A
JP2000029219A
Attorney, Agent or Firm:
Aun Agata
Takatoshi Mizuguchi