Title:
後処理装置、後処理制御方法および後処理制御プログラム
Document Type and Number:
Japanese Patent JP7338249
Kind Code:
B2
Abstract:
To perform post-processing to a second bundle while aligning a first bundle.SOLUTION: A post-processing device comprises: alignment plates 261L, R which align the first bundle S1; an insertion port to which the second bundle is inserted; and a staple unit 271 which can execute post-processing to the first bundle S1 aligned to a post-processing position at a first position on a movement path T2 and execute post-processing to the second bundle inserted to the insertion port at a second position on a movement path T4. The staple unit 271 is configured to interfere with the first bundle S1 aligned at the post-processing position in an interference region between the first position and the second position, and controls the alignment plates 261L, R before the staple unit moves in the interference region in the state where the first bundle S1 is aligned at the post-processing position to move the staple unit 271 after moving the first bundle S1 aligned at the post-processing position to a retreat position that does not interfere with the staple unit 271 in the interference region.SELECTED DRAWING: Figure 15
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Inventors:
Yasuomi Mitsui
Application Number:
JP2019105641A
Publication Date:
September 05, 2023
Filing Date:
June 05, 2019
Export Citation:
Assignee:
Konica Minolta, Inc.
International Classes:
B65H37/04; B65H31/34
Domestic Patent References:
| JP2016011189A | ||||
| JP2017013996A | ||||
| JP2013095555A | ||||
| JP2009018932A | ||||
| JP2015040084A | ||||
| JP2019001661A | ||||
| JP2009234727A | ||||
| JP2017081696A |
Attorney, Agent or Firm:
Masahiro Nakagawa