Title:
PRECOAT-TYPE ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP3477854
Kind Code:
B2
Abstract:
PURPOSE: To obtain an assembling part with a precoated adhesive layer which has excellent storage stability and with which the step of bonding in assembling can be performed at low temperatures in a short time by using a specified resin and a specified reactive monomer.
CONSTITUTION: An assembling part precoated with an epoxy resin is prepared by premixing component II comprising an epoxy composition essentially consisting of an epoxy resin and a powdery curing agent with component I comprising a reactive monomer compatible with the powdery curing agent to give a thermoplastic cured product, applying the obtained premix to the adhered, and selectively curing component I without curing component II to immobilize unreacted component II within a cured film of component I of the adhered. Component I is cured by, e.g. ultraviolet irradiation, low-temperature heating, or curing with atmospheric moisture. The precoated assembling part is heated till the cured film of component I is softened into a flowable or liquid state and is allowed to abut against an adherend. A latent curing agent is used as the powdery curing agent.
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Inventors:
Hanada Minami
Toshiro Arai
Toshiro Arai
Application Number:
JP27545694A
Publication Date:
December 10, 2003
Filing Date:
October 04, 1994
Export Citation:
Assignee:
ThreeBond Co., Ltd.
International Classes:
C08G59/40; C08G59/50; C09J5/06; C09J163/00; (IPC1-7): C09J163/00; C08G59/40; C09J5/06
Domestic Patent References:
| JP853655A | ||||
| JP358493A | ||||
| JP384026A | ||||
| JP476081A | ||||
| JP2289609A | ||||
| JP5221100A | ||||
| JP2173749A | ||||
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