Title:
PREPREG, PRODUCTION METHOD THEREOF AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2008031222
Kind Code:
A
Abstract:
To provide a prepreg suppressing warpage of a molded laminate plate, a printed wiring board.
This prepreg is a prepreg in which dispersion of the unit weight of the prepreg in the width direction thereof after impregnating a lengthy substrate 1 with a resin varnish 3 and drying satisfies the following formula (1):(Wmax-Wmin)/Wave3% wherein Wmax represents the prepreg maximum weight(g/m2), Wmin represents the prepreg minimum weight(g/m2), Wave represents the prepreg average weight(g/m2).
Inventors:
ABE TOMOYUKI
YONEMOTO KAMIO
TAWARA AKITOMO
YONEMOTO KAMIO
TAWARA AKITOMO
Application Number:
JP2006203713A
Publication Date:
February 14, 2008
Filing Date:
July 26, 2006
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08J5/24; H05K1/03
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Attorney, Agent or Firm:
Toshio Nishizawa