To provide a prepreg that can respond to a demand for reduction in thickness and allows adjustment of a resin amount in accordance with a circuit pattern, and to provide a substrate including the prepreg and a semiconductor device.
The prepreg 10 comprises a fiber substrate 1 comprising glass fiber, a first resin layer 21 located on one surface side of the fiber substrate 1, and a second resin layer 22 located on the other surface side of the fiber substrate 1. Each of the first resin layer 21 and the second resin layer 22 is formed with a resin composition comprising a thermosetting resin, an inorganic filler and a coupling agent. The thickness of the first resin layer 21 is larger than the thickness of the second resin layer 22. A circuit wiring part 4 is embedded in the first resin layer 21. When the distance between the circuit wiring part 4 and the fiber substrate 1 is denoted by t2 [μm], t2 ranges from 3 to 15 [μm].
BABA TAKAYUKI
YUASA MADOKA
| JP2003340952A | 2003-12-02 | |||
| JPH1034649A | 1998-02-10 | |||
| JPH09202834A | 1997-08-05 |
Kazuo Asahi
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