PURPOSE: To enclose the plating scraps produced during press fitting a connector to avoide scattering of the scraps by a method wherein both surfaces of thin plastic films laminated on the printed-circuit board whose through hole is press fitted with a connector having compliant part for solderless connection.

CONSTITUTION: Both surfaces of the printed board 1 are laminated with thin plastic films 2. A connector 7 is press fitted into a through hole 5 part so as to penetrate the compliant part 6 into the through hole 5 part. The plastic films 2 are made of a soft material so as to block the gaps between the molds 8 of the connector 7 and the printed board 1 on the component mounting side of the printed substrate. Besides, on the lead terminal side, the plastic film 2 is bonded onto the gap between the lead terminal 3 and the through hole 5 so as to block the gap. Through these procedures, the plating scraps 4 produced during press fitting step of the connector 7 adhering to the patterns and lead arranged around at narrow pitch can avoid the development of defective short circuit.