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Title:
PRINTED WIRING BOARD AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH05226812
Kind Code:
A
Abstract:

PURPOSE: To provide a printed wiring board in which connection members are securely connected and fixed to circuit conductors and provide the manufacturing method of the printed wiring board.

CONSTITUTION: A printed wiring board 20 is composed of a circuit board 22, circuit conductor parts 24 which have required patterns and are buried in the board 22 so as to have their smooth surfaces on the same level as the surface of the board 22 and intermediate connection parts 28 which are formed on the smooth surfaces of the circuit conductor parts 24 at a plurality of necessary positions so as to adhere tightly to the circuit conductor parts 24 to connect electrically the necessary positions of the circuit conductor parts 24 to each other.


Inventors:
AKIMOTO YUTAKA
Application Number:
JP6903992A
Publication Date:
September 03, 1993
Filing Date:
February 18, 1992
Export Citation:
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Assignee:
NEC CORP
International Classes:
H05K1/11; H05K3/20; H05K3/40; H05K1/00; H05K3/10; (IPC1-7): H05K1/11; H05K3/20; H05K3/40
Domestic Patent References:
JPS547170A1979-01-19
JPH03284894A1991-12-16
JPS61267396A1986-11-26
JPH02113589A1990-04-25
Attorney, Agent or Firm:
Tadao Hirata (2 outside)



 
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