Title:
PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2021013968
Kind Code:
A
Abstract:
To provide a processing device that can be prevented from being complicated and increased in size.SOLUTION: A processing device 1 comprises a spindle acting as a rotating shaft, a mount fixed to the spindle, and a blade exchange mechanism that attaches and detaches the cutting blade 21 to and from the mount. The mount includes a columnar boss part extending in a longitudinal direction being a Y-axis direction, a support surface that protrudes outward in a radial direction from behind the boss part to support the cutting blade 21, and a suction hole which is communicated with a suction source through a suction path and makes pressure between the support surface and the cutting blade 21 negative to suck and fix the cutting blade 21. The blade exchange mechanism includes at least one blade chuck that detaches the cutting blade 21 from the mount and another blade chuck that attaches the cutting blade to the mount.SELECTED DRAWING: Figure 1
Inventors:
KOZAI HIROHIKO
TERADA KAZUTAKA
FUJIE KENICHI
YASUDA SHINYA
TERADA KAZUTAKA
FUJIE KENICHI
YASUDA SHINYA
Application Number:
JP2019128773A
Publication Date:
February 12, 2021
Filing Date:
July 10, 2019
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B45/00; B24B27/06; H01L21/301
Domestic Patent References:
| JP2016144839A | 2016-08-12 | |||
| JP2007105829A | 2007-04-26 | |||
| JP2019013988A | 2019-01-31 |
Attorney, Agent or Firm:
Sakai International Patent Office