Title:
PROCESSING METHOD FOR WAFER
Document Type and Number:
Japanese Patent JP2020061398
Kind Code:
A
Abstract:
To provide a processing method for a wafer, capable of appropriately dividing the wafer into individual device chips, as well as reducing a thickness of the wafer by grinding a back surface of the wafer.SOLUTION: A processing method for a wafer 10, comprises at least: a step of distributing a protection tape 16 of a front face of the wafer; a step of exposing a back face 10b of the wafer by holding a protection tape side to a chuck table 24 that holds and heats the wafer so as to be faced; a step of forming a division initial point formed by a modified layer 100 and a crack 102 extending to the front face from the modified layer along a division schedule line by irradiating a focal point while positioning it from the front face of the wafer into a prescribed inner part; a step of reducing a thickness of the wafer by grinding a back face of the wafer with a grinding wheel which has a grinder stone in an annular, and dividing the wafer into individual device chips. In the division initial point formation step, the chuck table is heated to a prescribed temperature, and grows the crack from the modified layer formed in the inner part of the wafer to the front face.SELECTED DRAWING: Figure 4
Inventors:
NAKAMURA MASARU
Application Number:
JP2018189719A
Publication Date:
April 16, 2020
Filing Date:
October 05, 2018
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B23K26/10; B23K26/53; B24B1/00; B24B7/04; H01L21/304
Domestic Patent References:
| JP2016042511A | 2016-03-31 | |||
| JP2016213318A | 2016-12-15 | |||
| JP2004268103A | 2004-09-30 | |||
| JP2003088982A | 2003-03-25 |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Kojino Koji
Yoshifumi Kaneko
Sachiko Okunuki
Kojino Koji
Yoshifumi Kaneko